Kwiisekethe okanye kwiinkqubo ze-microwave, yonke isekethe okanye inkqubo idla ngokwenziwa zizixhobo ezininzi ezisisiseko ze-microwave ezifana nezihluzi, ii-couplers, izahluli zamandla, njl. Kuthenjwa ukuba ngezi zixhobo, kunokwenzeka ukuhambisa amandla esignali ngokufanelekileyo ukusuka kwelinye inqanaba ukuya kwelinye ngaphandle kokulahlekelwa kakhulu;
Kwinkqubo yonke yeradar yesithuthi, ukuguqulwa kwamandla kubandakanya kakhulu ukudluliselwa kwamandla ukusuka kwitshiphu ukuya kwi-feeder kwibhodi ye-PCB, ukudluliselwa kwe-feeder ukuya emzimbeni we-antenna, kunye nokukhanya kwamandla okusebenzayo yi-antenna. Kwinkqubo yonke yokudluliselwa kwamandla, inxalenye ebalulekileyo kuyilo lwe-converter. Ii-converters kwiinkqubo zamaza e-millimeter ziquka ukuguqulwa kwe-microstrip ukuya kwi-substrate integrated waveguide (SIW), ukuguqulwa kwe-microstrip ukuya kwi-waveguide, ukuguqulwa kwe-SIW ukuya kwi-waveguide, ukuguqulwa kwe-coaxial ukuya kwi-waveguide, ukuguqulwa kwe-waveguide ukuya kwi-waveguide kunye neentlobo ezahlukeneyo zokuguqulwa kwe-waveguide. Le ngxaki iya kugxila kuyilo lokuguqulwa kwe-microband SIW.
Iintlobo ezahlukeneyo zezakhiwo zothutho
I-Microstripyenye yezona zakhiwo zesikhokelo ezisetyenziswa kakhulu kwiifrikhwensi ze-microwave eziphantsi. Iingenelo zayo eziphambili kukwakheka okulula, iindleko eziphantsi kunye nokuhlanganiswa okuphezulu nezinto zokufaka umphezulu. Umgca we-microstrip oqhelekileyo wenziwa kusetyenziswa ii-conductors kwelinye icala le-substrate yomaleko we-dielectric, zenze iplani enye yomhlaba kwelinye icala, enomoya ngaphezulu kwayo. I-conductor ephezulu ngokuyintloko yinto eqhubayo (ngesiqhelo ithusi) eyenziwe yaba yintambo emxinwa. Ububanzi bomgca, ubukhulu, imvume ehambelanayo, kunye ne-dielectric loss tangent ye-substrate zizinto ezibalulekileyo. Ukongeza, ubukhulu bomqhubi (oko kukuthi, ubukhulu be-metallization) kunye ne-conductivity yomqhubi nazo zibalulekile kwiifrikhwensi eziphezulu. Ngokuqwalasela ngononophelo ezi parameters kunye nokusebenzisa imigca ye-microstrip njengeyunithi esisiseko kwezinye izixhobo, izixhobo ezininzi ze-microwave eziprintiweyo kunye nezinto zinokuyilwa, ezifana nezihluzi, ii-couplers, ii-power dividers/combiners, ii-mixers, njl. Nangona kunjalo, njengoko i-frequency isanda (xa isiya kwiifrikhwensi ze-microwave eziphezulu) ilahleko zokudluliselwa ziyanda kwaye kwenzeka i-radiation. Ke ngoko, ii-hollow tube waveguides ezifana nee-rectangular waveguides ziyathandwa ngenxa yokulahleka okuncinci kwiifrikhwensi eziphezulu (akukho radiation). Ingaphakathi le-waveguides lidla ngokuba ngumoya. Kodwa ukuba uyafuna, ingazaliswa ngezinto ze-dielectric, nto leyo eyenza ibe ncinci kune-waveguide egcwele igesi. Nangona kunjalo, ii-hollow tube waveguides zihlala zinkulu, zinokuba nzima ngakumbi kumaza aphantsi, zifuna iimfuno eziphezulu zokwenziwa kwaye zibiza kakhulu, kwaye azinakudityaniswa nezakhiwo eziprintiweyo zeplanar.
IIMPAHLA ZE-ANTENNA ZE-RFMISO MICROSTRIP:
Esinye sisakhiwo sesikhokelo esidityanisiweyo phakathi kwesakhiwo se-microstrip kunye ne-waveguide, ebizwa ngokuba yi-substrate integrated waveguide (SIW). I-SIW sisakhiwo esidibeneyo esifana ne-waveguide esenziwe kwi-dielectric material, kunye nee-conductors phezulu nasezantsi kunye noluhlu oluthe ngqo lwee-vias ezimbini zesinyithi ezenza iindonga ezisecaleni. Xa kuthelekiswa nezakhiwo ze-microstrip kunye ne-waveguide, i-SIW ixabisa kancinci, inenkqubo yokuvelisa elula, kwaye inokudityaniswa nezixhobo ezicwangcisiweyo. Ukongeza, ukusebenza kwi-frequency ephezulu kungcono kunokwezakhiwo ze-microstrip kwaye kuneempawu ze-waveguide dispersion. Njengoko kubonisiwe kuMfanekiso 1;
Izikhokelo zoyilo lwe-SIW
Ii-substrate integrated waveguides (ii-SIW) zizakhiwo ezidityanisiweyo ezifana ne-waveguides ezenziwe ngokusebenzisa imigca emibini yee-metal vias ezifakwe kwi-dielectric edibanisa iipleyiti ezimbini zesinyithi ezihambelanayo. Imigca yesinyithi edlula kwimingxunya yenza iindonga ezisecaleni. Olu lwakhiwo luneempawu zemigca ye-microstrip kunye nee-waveguides. Inkqubo yokuvelisa ikwafana nezinye izakhiwo ezithe tyaba eziprintiweyo. I-geometry eqhelekileyo ye-SIW iboniswe kuMfanekiso 2.1, apho ububanzi bayo (oko kukuthi ukwahlukana phakathi kwee-vias kwicala elisecaleni (as)), ububanzi bee-vias (d) kunye nobude bepitch (p) zisetyenziselwa ukuyila ulwakhiwo lwe-SIW. Iiparameter zejometri ezibaluleke kakhulu (eziboniswe kuMfanekiso 2.1) ziya kuchazwa kwicandelo elilandelayo. Qaphela ukuba imo elawulayo yi-TE10, njenge-waveguides yoxande. Ubudlelwane phakathi kwe-cutoff frequency fc yee-waveguides ezizaliswe ngumoya (AFWG) kunye nee-waveguides ezizaliswe ngumbane (DFWG) kunye nobukhulu u-a kunye no-b yindawo yokuqala yoyilo lwe-SIW. Kwii-waveguides ezizaliswe ngumoya, i-cutoff frequency injengoko kubonisiwe kwifomyula engezantsi.
Isakhiwo esisisiseko se-SIW kunye nefomula yokubala [1]
apho u-c sisantya sokukhanya kwindawo ekhululekileyo, u-m kunye no-n ziimodes, u-a bubungakanani be-waveguide ende, kwaye u-b bubungakanani be-waveguide emfutshane. Xa i-waveguide isebenza kwimo ye-TE10, ingenziwa lula ibe yi-fc=c/2a; xa i-waveguide izaliswe yi-dielectric, ubude be-bside a bubalwa yi-ad=a/Sqrt(εr), apho u-εr yi-dielectric constant ye-medium; ukuze yenze i-SIW isebenze kwimo ye-TE10, isithuba se-through hole p, ububanzi be-d kunye necala elibanzi njengoko kufuneka lanelise ifomula ekwicala eliphezulu lasekunene lomfanekiso ongezantsi, kwaye kukwakho neefomula ze-empirical ze-d<λg kunye ne-p<2d [2];
apho i-λg ilubude be-wave obukhokelwayo: Kwangaxeshanye, ubukhulu be-substrate abuyi kuchaphazela uyilo lobungakanani be-SIW, kodwa buya kuchaphazela ukulahleka kwesakhiwo, ngoko ke iingenelo zokulahleka okuphantsi kwe-substrates ezinobukhulu obuphezulu kufuneka ziqwalaselwe.
Ukuguqulwa kwe-SIW ukuya kwi-Microstrip
Xa isakhiwo se-microstrip kufuneka sidityaniswe kwi-SIW, utshintsho lwe-microstrip oluthambileyo yenye yeendlela eziphambili zotshintsho ezikhethwayo, kwaye utshintsho oluthambileyo ludla ngokubonelela ngomdlalo we-broadband xa kuthelekiswa nezinye iinguqu eziprintiweyo. Isakhiwo sotshintsho esiyilwe kakuhle sineembonakalo eziphantsi kakhulu, kwaye ilahleko yokufakelwa ibangelwa ikakhulu kukulahlekelwa yi-dielectric kunye ne-conductor. Ukukhethwa kwezinto ze-substrate kunye ne-conductor ikakhulu kumisela ilahleko yotshintsho. Ekubeni ubukhulu be-substrate buthintela ububanzi bomgca we-microstrip, iiparameter zotshintsho oluthambileyo kufuneka zilungiswe xa ubukhulu be-substrate butshintsha. Olunye uhlobo lwe-grounded coplanar waveguide (GCPW) lukwayindlela yomgca wothumelo esetyenziswa kakhulu kwiinkqubo ze-high-frequency. Ii-side conductors ezikufutshane nomgca wothumelo oluphakathi nazo zisebenza njengomhlaba. Ngokulungisa ububanzi be-feeder ephambili kunye nesithuba somhlaba osecaleni, i-impedance efunekayo inokufunyanwa.
I-Microstrip ukuya kwi-SIW kunye ne-GCPW ukuya kwi-SIW
Umfanekiso ongezantsi ngumzekelo woyilo lwe-microstrip kwi-SIW. I-medium esetyenzisiweyo yiRogers3003, i-dielectric constant yi-3.0, ixabiso lokulahleka lokwenyani yi-0.001, kwaye ubukhulu buyi-0.127mm. Ububanzi be-feeder kuzo zombini iziphelo yi-0.28mm, ehambelana nobubanzi be-antenna feeder. Ububanzi be-through hole buyi-d=0.4mm, kwaye i-spacing p=0.6mm. Ubungakanani be-simulation yi-50mm*12mm*0.127mm. Ilahleko iyonke kwi-passband imalunga ne-1.5dB (enokuncitshiswa ngakumbi ngokuphucula i-wide-side space).
Ulwakhiwo lwe-SIW kunye neeparamitha zayo ze-S
Usasazo lwentsimi yombane @ 79GHz
Ixesha leposi: Jan-18-2024

